Polypropylene card construction

ABSTRACT

An image retaining card is disclosed. An image retaining card in accordance with the present invention may be utilized as an identification card, a driver&#39;s license, a passport, and the like. An image retaining card in accordance with the present invention comprises a substrate structure, a cover, and an image receptive material disposed between the substrate structure and the cover. The substrate structure comprises a substrate layer and a substrate tie layer.

FIELD OF INVENTION

The present invention relates generally to image retaining cards. Moreparticularly, the present invention relates to image retaining cards forsuch things as identification cards, a driver's licenses, passports, andthe like.

BACKGROUND

Identification cards and related products have been used for many yearsas a means for persons to establish their identity and credentials.These identification cards are typically kept on the person of the cardholder. For example, the card may be kept in the card holder's wallet.Identification cards are often utilized on a daily basis to obtainentrance into a controlled area. During daily use, the identificationcard may be flexed repeatedly. Even when inside a wallet, theidentification card may be subjected to repeated flexing. Identificationcards frequently develop cracks, and/or delaminate due to repeatedflexing during use.

SUMMARY OF INVENTION

An image retaining card in accordance with the present invention may beutilized as an identification card, a driver's license, a passport, etc.An image retaining card in accordance with the present inventioncomprises a substrate structure, a cover, and an image receptivematerial disposed between the substrate structure and the cover. Thesubstrate structure comprises a substrate layer and a preferred butoptional substrate tie layer.

In a useful embodiment, the substrate layer of the substrate structurecomprises a polyolefin. In a particularly useful embodiment, thesubstrate layer of the substrate structure comprises polypropylene. In apreferred method in accordance with the present invention, the substratelayer and the optional substrate tie layer are formed utilizing aco-extrusion process. In a particularly preferred embodiment, thesubstrate layer comprises a blend of materials including the tie layermaterial to enhance the adhesion between substrate tie layer andsubstrate layer.

An image retaining card including polypropylene exhibits good abrasionresistance, low cost, and good crack resistance. In a preferredembodiment, the substrate tie layer of the substrate structure comprisesfunctionalized polyolefin. An image retaining card including a substratetie layer comprising functionalized polyolefin exhibits good resistanceto delamination.

In one embodiment, the image receptive material is comprised of amicroporous polymeric film. An identification card comprising an imageretaining card including a microporous polymeric film and an imageprinted on the microporous polymeric film exhibits desirableanti-tampering characteristics. In particular, if an image retainingcard in accordance with the present invention is delaminated the printedimage will be substantially distorted andlor destroyed. For example,during delamination, the image receptive material may stretch,distorting the image.

In a preferred embodiment, the image receptive material is adapted toreceive an aqueous ink from an inkjet printer. Aqueous ink from aninkjet printer is preferred because inkjet printers are readilyavailable at low cost.

In a preferred embodiment, the image retaining card includes a printedimage having one or more security indicia. Examples of security indiciawhich may be suitable in some applications include, a picture of a humanface, a representation of a human finger print, and a representation ofa cardholder's signature.

In a preferred embodiment, the cover comprises an optically transparentpolymeric film. An optically transparent polymeric film is preferred, sothat the printed image may be viewed through the cover. Also in apreferred embodiment, the cover is fixed to the image receptivematerial, for example, by heat bonding. An image retaining cardincluding a cover heat bonded to an image receptive material having aprinted image disposed on its surface exhibits desirable anti-tamperingcharacteristics. In particular, if the protective layer is separatedfrom the image receptive material, the printed image will besubstantially distorted and/or destroyed. For example, duringdelamination, a portion of the ink may adhere to the cover and a portionof the ink may adhere to the image receptive material, making imagealteration difficult.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partially exploded cross-sectional view of an imageretaining card including a substrate structure and an image receptivematerial in accordance with the present invention;

FIG. 2 is a diagrammatic representation of a method in accordance withthe present invention which may be utilized to fabricate the substratestructure of the image retaining card of FIG. 1;

FIG. 3 is a diagrammatic representation of an additional method inaccordance with the present invention which may be utilized to fabricatethe substrate structure of the image retaining card of FIG. 1;

FIG. 4 is a diagrammatic representation of a method in accordance withthe present invention which may be utilized to assemble the substratestructure and the image receptive material of the image retaining cardof FIG. 1;

FIG. 5 is a partially exploded cross-sectional view of an additionalembodiment of an image retaining card including an intermediatestructure in accordance with the present invention;

FIG. 6 is a diagrammatic representation of a method of fabricating theintermediate structure of the image retaining card of FIG. 5;

FIG. 7 is a diagrammatic representation of an additional method offabricating the intermediate structure of the image retaining card ofFIG. 5;

FIG. 8 is a partially exploded cross-sectional view of an additionalembodiment of an image retaining card in accordance with the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following detailed description should be read with reference to thedrawings, in which like elements in different drawings are numbered inlike fashion. The drawings which are highly diagrammatic, depictselected embodiments, and are not intended to limit the scope of theinvention. Examples of constructions, materials, dimensions, andmanufacturing processes are provided for various elements. Those skilledin the art will recognize that many of the examples provided havesuitable alternatives which may be utilized.

FIG. 1 is a partially exploded cross-sectional view of an imageretaining card 100 in accordance with the present invention. Imageretaining card 100 comprises a substrate structure 102, an intermediatestructure 104, and a cover 106. As shown in FIG. 1, intermediatestructure 104 is disposed between substrate structure 102 and cover 106.In a preferred embodiment intermediate structure 104 is fixed tosubstrate structure 102 and cover 106. In a particularly preferredembodiment, intermediate structure 104 is heat bonded to substratestructure 102 and cover 106.

Substrate structure 102 comprises a substrate layer 108 and a substratetie layer 120. Intermediate structure 104 comprises an image receptivematerial 122. As shown in FIG. 1, substrate tie layer 120 overlayssubstrate layer 108. Also as shown in FIG. 1, image receptive material122 of intermediate structure 104 overlays substrate tie layer 120.Cover 106 comprises a protective material 124. In FIG. 1, it may beappreciated that protective material 124 of cover 106 overlays imagereceptive material 122.

A printed image 126 comprising an ink 128 is disposed proximate imagereceptive material 122. In a preferred embodiment, ink 128 comprises anaqueous ink 128. In a particularly preferred embodiment ink 128comprises an aqueous ink 128 adapted for use in an inkjet printer.

Image retaining card 100 of FIG. 1 may comprise an identification card,a driver's license, a passport, etc. having a printed image 126. In apreferred embodiment, printed image 126 includes one or more securityindicia. Examples of security indicia which may be suitable in someapplications include, a picture of a human face, a representation of ahuman finger print, a bar code, and a representation of a cardholder'ssignature.

Substrate Layer

In a preferred embodiment, substrate layer 108 comprises a polyolefinmaterial. In a preferred embodiment, substrate layer 108 comprisespolypropylene. An image retaining card including a polyolefin substratelayer exhibits good abrasion resistance, and crack resistance.

Substrate layer 108 may include a filler. Examples of fillers which maybe suitable in some applications include calcium carbonate, fumedsilica, precipitated silica, alumina, alkyl quaternary ammoniumbentonite, alkyl quaternary ammonium montmorillonite, clay, kaolin,talcum, titanium oxide, chalk, bentonite, aluminum silicate, calciumsilicate, magnesium carbonate, calcium sulfate, barium sulfate, siliciumoxide, barium carbonate, boehinite, pseudo boehmite, mica, glass fibers,polymeric fibers, graphite fibers, wollastonite, and the like.

In some cases it may be desirable to emboss substrate layer 108. In auseful embodiment the thickness of substrate layer 108 (prior toembossing) is, for example, between about 50 and about 2500 microns. Ina preferred embodiment the thickness of substrate layer 108 (prior toembossing) is, for example, between about 150 and about 1500 microns. Ina particularly preferred embodiment the thickness of substrate layer 108(prior to embossing) is, for example, between about 500 and about 1000microns. The particular thickness will depend upon the desiredflexibility of the card and the desirability of placing microchips andother devices in substrate layer 108.

In a preferred embodiment, substrate layer 108 is fixed to substrate tielayer 120. In a particularly preferred embodiment, substrate layer 108is fixed to substrate tie layer 120 during formation of the layersutilizing a co-extrusion process. Processes in accordance with thepresent invention produce a desirably strong bond between the substratelayer and the substrate tie layer. The bond strength between substratetie layer 120 and substrate layer 108 may be increased by blendingsubstrate tie layer material into substrate layer 108.

Substrate tie layer

In a preferred embodiment, substrate tie layer 120 is comprised of afunctionalized polyolefin. An image retaining card including a substratetie layer comprising functionalized polyolefin exhibits good resistanceto delamination. Examples of functionalized olefins include anhydridemodified polypropylene, acid modified polyolefins, and acid/anhydridemodified polyolefins. Examples of commercially available materials whichmay be suitable in some applications include ELVAX 3175 ethylene vinylacetate polymer, and BYNEL 3101 acid/acrylate-modified ethylene vinylacetate polymer, ELVALOY 741 resin modifier, and FUSABOND polymericcoupling agent which are all commercially available from E. I. DuPont deNemours and Company of Wilmington, Del.

Substrate tie layer 120 may be comprised of other materials withoutdeviating from the spirit and scope of the present invention. Examplesof materials which may be suitable in some applications include acidand/or acrylate modified ethylene vinyl acetate polymers (EVA),anhydride modified vinyl acetate polymers, and carbon monoxide modifiedethylene vinyl acetate polymer.

In a preferred embodiment of the present invention, substrate tie layer120 and substrate layer 108 are formed utilizing a co-extrusion process.In a particularly preferred embodiment, substrate layer 108 comprises ablend of materials including the tie layer material, to enhance theadhesion between substrate tie layer 120 and substrate layer 108.

Image receptive material

In a preferred embodiment, image receptive material 122 is comprised ofan open-cell, microporous film. For example, a suitable film is onecomprising essentially linear ultrahigh molecular weight polyethylene,filled with a finely divided particulate substantially water insolublesiliceous filler, having a weight ratio of the filler to polymer in themixture of from about 1:1 to 9:1. Such films are described in U.S. Pat.No. 4,833,172. In a particularly preferred embodiment, image receptivematerial 122 is modified to be compatible with inkjet printing inks.Examples of commercially available materials which may be suitable insome applications include TESLIN which is commercially available fromPittsburgh Paint and Glass (PPG).

An identification card comprising an image retaining card including amicroporous polymeric film and an image printed on the microporouspolymeric film exhibits desirable anti-tampering characteristics. Inparticular, if an image retaining card in accordance with the presentinvention is delaminated the printed image will be substantiallydistorted and/or destroyed. For example, during delamination, the imagereceptive material may stretch, distorting the image.

Image receptive material 122 may be comprised of other materials withoutdeviating from the spirit and scope of the present invention. Examplesof materials which may be suitable in some applications includesynthetic papers, and synthetic membranes. It is to be appreciated thatimage receptive material 122 may comprise woven or non-woven materials.It is also to be appreciated that image receptive material 122 maycomprise synthetic or natural materials. Image receptive material 122 ispreferably at least about 10 μm thick.

Printed Image

In FIG. 1, it may be appreciated that a printed image 126 is disposedproximate image receptive material 122. In a preferred embodiment,printed image 126 is comprised of ink. In a particularly preferredembodiment, printed image 126 is comprised of ink which is adapted to beapplied to a substrate with an inkjet printer. Ink adapted for use in aninkjet printer is preferred because inkjet printers are readilyavailable at low cost.

Ink in accordance with the present invention may include many componentswithout deviating from the spirit and scope of the present invention.Examples of ink components which may be suitable in some applicationsinclude pigments, dyes, solvents, and binders. In a particularlypreferred embodiment, printed image 126 is comprised of aqueous ink.Examples of solvents typically utilized in aqueous inks include water,ethylene glycol, diethylene glycol, and propylene glycol. It is to beappreciated that other fluids may be applied to image receptive material122 without deviating from the spirit and scope of the presentinvention.

Printed image 126 may be fabricated utilizing many printing processeswithout deviating from the spirit and scope of the present invention.Examples of printing methods which may be suitable in some applicationsinclude inkjet printing, laser printing, flexographic printing, offsetprinting, electro-static printing, gravure printing, screen printing,valve jet, and spray jet.

A printed image in accordance with the present invention may include asecurity indicia or a plurality of security indicia. Examples ofsecurity indices include, a picture of a human face, a representation ofa human finger print, a bar code, and a representation of thecardholders signature.

Cover

In a preferred embodiment, cover 106 comprises a protective material124. Protective material 124 preferably comprises a substantiallyoptically transparent polymeric film. Also in a preferred embodiment,protective material 124 comprises an ionomeric polymer. Particularlypreferred ionomeric polymers are copolymers of ethylene with methacrylicacid. E. I. DuPont de Nemours Company produces a line of neutralizedethylene-co-methacrylic acid ionomeric polymers under the tradedesignation “SURLYN” that are acceptable for the present use. Protectivematerial 124 may be comprised of other materials without deviating fromthe spirit and scope of the present invention. Examples of materialswhich may be suitable in some applications include polyvinyl chloride(PVC), polypropylene (PP), polyethylene (PE), acrylic, polyester,biaxially oriented polypropylene, and copolymers thereof.

In a preferred embodiment, protective material 124 is opticallytransparent so that printed image 126 may be viewed through protectivematerial 124. Also in a preferred embodiment, protective material 124 isfixed to image receptive material 122. In a particularly preferredembodiment, protective material 124 is fixed to image receptive material122 utilizing a heat and/or pressure bonding process.

An identification card comprising an image retaining card including aprotective material 124 heat bonded to an image receptive materialhaving a printed image disposed on its surface exhibits desirableanti-tampering characteristics. In particular, if the protective layeris separated from the image receptive material, the printed image willbe substantially distorted and/or destroyed. For example, duringdelamination, a portion of the ink may adhere to the protective layerand a portion of the ink may adhere to the image receptive material,making image alteration difficult.

Additives

Substrate structure 102, intermediate structure 104, and cover 106 ofimage retaining card 100 may all include additives without deviatingfrom the spirit and scope of the present invention. Examples ofadditives which may be suitable in some applications include dyes,colorants, pigments, fillers, lubricants, antioxidants, surface activeagents, ultraviolet light stabilizers, viscosity modifiers, and thelike. Examples of fillers which may be suitable in some applicationsinclude calcium carbonate, fumed silica, precipitated silica, alumina,alkyl quaternary ammonium bentonite, alkyl quaternary ammoniummontmorillonite, clay, kaolin, talcum, titanium oxide, chalk, bentonite,aluminum silicate, calcium silicate, magnesium carbonate, calciumsulfate, barium sulfate, silicium oxide, barium carbonate, boehmite,pseudo boehmite, mica, glass fibers, polymeric fibers, graphite fibers,wollastonite, melt additives, adhesion promoters, and the like.

FIG. 2 is a diagrammatic representation of a method in accordance withthe present invention which may be utilized to fabricate substratestructure 102 of image retaining card 100 of FIG. 1. FIG. 2 illustratesa co-extrusion system 110 including a first extruder 112 and a secondextruder 114. First extruder 112 has a first material hopper 116 holdinga substrate layer material 138. Likewise, second extruder 114 has asecond material hopper 118 holding a substrate tie layer material 130.

A method of co-extruding substrate structure 102 may include the step ofplacing substrate layer material 138 into first material hopper 116 offirst extruder 112. A method of co-extruding an substrate structure 102may include the step of placing substrate tie layer material 130 intosecond material hopper 118 of second extruder 114. Substrate layermaterial 138 and substrate tie layer material 130 are urged through aco-extrusion head 132 utilizing first extruder 112 and second extruder114, respectively to form substrate structure 102. Processes inaccordance with the present invention produce a desirably strong bondbetween substrate layer material 138 and substrate tie layer material130.

In FIG. 2, substrate structure 102 is shown exiting co-extrusion head132 and passing through a cooling station 134. A rewind station 136 isalso illustrated in FIG. 2. In the method illustrated in FIG. 2, rewindstation 136 is utilized to wind substrate structure 102 forming a roll140. Other process steps may be preformed on substrate structure 102prior to winding. Examples of process steps which may be suitable insome applications include annealing, quenching, corona treating, flametreating, plasma treating, stretching, aligning, and the like.

FIG. 3 is a diagrammatic representation of an additional method inaccordance with the present invention which may be utilized to fabricatesubstrate structure 102 of image retaining card 100 of FIG. 1. In FIG.3, a first unwind station 242 is illustrated. First unwind station 242includes a first roll 246 comprising a plurality of turns of a substrateweb 244. In a preferred embodiment, substrate web 244 comprises the samematerial as substrate layer 108 of FIG. 1.

As shown in FIG. 3, substrate web 244 is unwound from first roll 246 andpasses through a first corona treating station 248. In the embodiment ofFIG. 3, first corona treating station 248 includes a treatment roller250, an electrode assembly 252, and a plurality of guide rollers 254.Subjecting a substrate web 244 to corona treatment prior to coatingdesirably increases the adhesion of the coated layer to substrate web244. Equipment suitable for corona treating a material is commerciallyavailable from Enercon Industries Corporation of Menomonee Falls, Wis.,Pillar Technologies of Hartland, Wis., and Corotec Corporation ofFarmington, Conn. Other surface treatment methods may be utilizedwithout deviating from the spirit and scope of the present invention.Examples of surface treatment methods include plasma treating, chemicaltreating, and flame treating. Equipment suitable for flame treating amaterial is commercially available from Flynn Burner Corporation of NewRochelle, N.Y. Plasma treating typically involves exposing the materialto a charged gaseous atmosphere.

After passing through first corona treatment station 248, substrate web244 enters a first coating station 256. In the embodiment of FIG. 3,first coating station 256 comprises a coating die 258, a backing roller260, and an extruder 212 having a tie material 211 disposed therein.First coating station 256 applies a substrate tie layer 220 to substrateweb 244 forming a substrate structure 102.

In FIG. 3, substrate structure 102 is shown exiting first coatingstation 256 and passing through a cooling station 234. A rewind station236 is also illustrated in FIG. 3. In the method illustrated in FIG. 3,rewind station 236 is utilized to wind substrate structure 102 forming aroll 240. Other process steps may be preformed on substrate structure102 prior to winding.

FIG. 4 is a diagrammatic representation of a method in accordance withthe present invention. The method of FIG. 4 may be utilized to assemblesubstrate structure 102 and image receptive material 122 of imageretaining card 100 of FIG. 1. In FIG. 4, a first unwind station 342 isillustrated. First unwind station 342 includes a first roll 346comprising a plurality of turns of substrate structure 102.

As shown in FIG. 4, substrate structure 102 is unwound from first roll346 and enters a laminating station 362. A second unwind station 364feeds image receptive material 122 into laminating station 362. In theembodiment of FIG. 4, laminating station 362 includes a plurality oflaminating rollers 366. In a preferred embodiment, laminating rollers366 are adapted to apply heat and pressure to substrate structure 102and image receptive material 122. In a preferred method in accordancewith the present invention, image receptive material 122 is heat bondedto substrate structure 102 to form a laminate 368.

In the embodiment of FIG. 4, laminate 368 exits laminating station 362and enters a die cutting station 370. In the embodiment of FIG. 4, diecutting station 370 includes a cutting die 372 fixed to a cutting diecylinder 374, and an anvil cylinder 378. Cutting die 372 is adapted tocut card blanks 376 from laminate 368. In FIG. 4, a plurality of cardblanks 376 are show disposed in a bin 380. A web weed 382 formed by theremainder of laminate 368 exits die cutting station and is wound onto aroll 340 of a rewind station 336.

Having thus described FIG. 1 through FIG. 4, methods in accordance withthe present invention may now be described with reference thereto. Itshould be understood that steps may be omitted from each process and/orthe order of the steps may be changed without deviating from the spiritor scope of the invention. It is anticipated that in some applications,two or more steps may be performed more or less simultaneously topromote efficiency.

A method of fabricating an image retaining card may begin with the stepof providing a card blank and a card cover. An image may be printed ontothe image receptive layer of the card blank. In a preferred method, theimage is printed onto the image receptive layer of the card blankutilizing an inkjet printer.

A method in accordance with the present invention may include the stepof laminating a cover over the image receptive layer of the card blank.The step of laminating a cover over the image receptive layer of thecard blank may include the steps of laying the cover over the cardblank, inserting the cover and the card blank into a protective sheath,and inserting the sheath into a laminator.

FIG. 5 is a partially exploded cross-sectional view of an additionalembodiment of an image retaining card 400 in accordance with the presentinvention. Image retaining card 400 comprises a substrate structure 402,an intermediate structure 404, and a cover 406. As shown in FIG. 5,intermediate structure 404 is disposed between substrate structure 402and cover 406. In a preferred embodiment intermediate structure 404 isfixed to substrate structure 402 and cover 406. In a particularlypreferred embodiment, intermediate structure 404 is heat bonded tosubstrate structure 402 and cover 406.

A printed image 426 comprising an ink 428 is disposed proximate an imagereceptive layer 484 of intermediate structure 404. In a preferredembodiment, ink 428 comprises an aqueous ink 428. In a particularlypreferred embodiment ink 428 comprises an aqueous ink 428 adapted foruse in an inkjet printer.

Image retaining card 400 of FIG. 5 may comprise an identification card,a driver's license, a passport, etc. having a printed image 426. In apreferred embodiment, printed image 426 includes one or more securityindicia. Examples of security indicia which may be suitable in someapplications include, a picture of a human face, a representation of ahuman finger print, and a representation of a cardholder's signature.

Intermediate structure

In the embodiment of FIG. 5, intermediate structure 404 comprises animage receptive layer 484, a first tie layer 486, a backing layer 490,and a second tie layer 488. As shown in FIG. 5, first tie layer 486 isdisposed between image receptive layer 484 and backing layer 490. InFIG. 5 it may also be appreciated that backing layer 490 is disposedbetween first tie layer 486 and second tie layer 488.

In a preferred embodiment, backing layer 490 comprises polyolefin. In aparticularly preferred embodiment, backing layer 490 comprisespolypropylene. Backing layer 490 may be comprised of other materialswithout deviating from the spirit and scope of the present invention.Examples of materials which may be suitable in some applicationsacrylic, polyester, and copolymers thereof.

In a preferred embodiment, first tie layer 486 and second tie layer 488of intermediate structure 404 are comprised of a functionalizedpolyolefin. Examples of functionalized olefins include anhydridemodified polypropylene, acid modified polyolefins, and acid andanhydride modified polyolefins.

First tie layer 486 and second tie layer 488 comprise of other materialswithout deviating from the spirit and scope of the present invention.Examples of materials which may be suitable in some applications includeacid and/or acrylate modified ethylene vinyl acetate polymers (EVA),anhydride modified vinyl acetate polymers, and carbon monoxide modifiedethylene vinyl acetate polymer. Examples of commercially availablematerials which may be suitable in some applications include ELVAX 3175ethylene vinyl acetate polymer, and BYNEL 3101 acid/acrylate-modifiedethylene vinyl acetate polymer, ELVALOY 741 resin modifier, and FUSABONDpolymeric coupling agent which are all commercially available from E. I.DuPont de Nemours and Company of Wilmington, Del.

In a preferred embodiment, image receptive layer 484 is comprised of anopen-cell, microporous film. For example, a suitable film is onecomprising essentially linear ultrahigh molecular weight polyethylene,filled with a finely divided particulate substantially water insolublesiliceous filler, having a weight ratio of the filler to polymer in themixture of from about 1:1 to 9:1. Such films are described in U.S. Pat.No. 4,833,172. In a particularly preferred embodiment, image receptivelayer 484 is modified to be compatible with inkjet printing inks.Examples of commercially available materials which may be suitable insome applications include TESLIN which is commercially available fromPittsburgh Paint and Glass (PPG).

An identification card comprising an image retaining card includingopen-cell microporous film and an image printed on the open-cellmicroporous film exhibits desirable anti-tampering characteristics. Inparticular, if an image retaining card in accordance with the presentinvention is delaminated the printed image will be substantiallydistorted and/or destroyed. For example, during delamination, the imagereceptive layer may stretch, distorting the image. Image receptive layer484 may be comprised of other materials without deviating from thespirit and scope of the present invention.

Printed Image

In FIG. 5, a printed image 426 is disposed proximate image receptivelayer 484 of intermediate structure 404. In a preferred embodiment,printed image 426 is comprised of ink. In a particularly preferredembodiment, printed image 426 is comprised of ink which is adapted to beapplied to a substrate with an inkjet printer. Ink adapted for use in aninkjet printer is preferred because inkjet printers are readilyavailable at low cost.

Printed image 426 may be fabricated utilizing many printing processeswithout deviating from the spirit and scope of the present invention. Aprinted image in accordance with the present invention may include asecurity indice or a plurality of security indicia. Examples of securityindices include, a picture of a human face, a representation of a humanfinger print, and a representation of the cardholders signature.

Substrate Structure

Substrate structure 402 of image retaining card 400 comprises asubstrate layer 408 and a substrate tie layer 420. In a preferredembodiment, substrate layer 408 is comprised of polypropylene. An imageretaining card including polypropylene exhibits good abrasionresistance, and crack resistance. Substrate layer 408 may be comprisedof other materials without deviating from the spirit and scope of thepresent invention.

In a preferred embodiment, substrate layer 408 is fixed to substrate tielayer 420. In a particularly preferred embodiment, substrate layer 408comprises a blend of materials including the tie layer material, toenhance the adhesion between substrate tie layer 420 and substrate layer408. In a preferred method in accordance with the present invention,substrate layer 408 is fixed to substrate tie layer 420 during formationof the layers utilizing a co-extrusion process. During the co-extrusionprocess, blending may occur between the material of the substrate layerand the material of the substrate tie layer. Processes in accordancewith the present invention produce a desirably strong bond between thesubstrate layer and the substrate tie layer.

In a preferred embodiment, substrate tie layer 420 of substratestructure 402 is comprised of a functionalized polyolefin. An imageretaining card including a substrate tie layer comprising functionalizedpolyolefin exhibits good resistance to delamination. Examples offunctionalized olefins include anhydride modified polypropylene, acidmodified polyolefins, and acid/anhydride modified polyolefins. Examplesof commercially available materials which may be suitable in someapplications include ELVAX 3175 ethylene vinyl acetate polymer, andBYNEL 3101 acid/acrylate-modified ethylene vinyl acetate polymer,ELVALOY 741 resin modifier, and FUSABOND polymeric coupling agent whichare all commercially available from E. I. DuPont de Nemours and Companyof Wilmington, Del.

In a presently preferred embodiment of the present invention, substratetie layer 420 and substrate layer 408 are formed utilizing aco-extrusion process. Substrate tie layer 420 may be comprised of othermaterials without deviating from the spirit and scope of the presentinvention.

Cover

In a preferred embodiment, cover 406 comprises a substantially opticallytransparent polymeric film. Also in a preferred embodiment, cover 406comprises an ionomeric polymer. Particularly preferred ionomericpolymers are copolymers of ethylene with methacrylic acid. E. I. DuPontde Nemours Company produces a line of neutralizedethylene-co-methacrylic acid ionomeric polymers under the tradedesignation “SURLYN” that are acceptable for the present use. Cover 406may comprise other materials without deviating from the spirit and scopeof the present invention. Examples of materials which may be suitable insome applications include polyvinyl chloride (PVC), polypropylene (PP),polyethylene (PE), acrylic, polyester, biaxially oriented polypropylene,and copolymers and/or blends thereof.

In a preferred embodiment, cover 406 is optically transparent so thatprinted image 426 may be viewed through cover 406. Also in a preferredembodiment, cover 406 is fixed to image receptive layer 484. In aparticularly preferred embodiment, cover 406 is fixed to image receptivelayer 484 utilizing a heat and/or pressure bonding process.

An identification card comprising an image retaining card including acover 406 heat bonded to an image receptive layer having a printed imagedisposed on its surface exhibits desirable anti-tamperingcharacteristics. In particular, if the cover is separated from the imagereceptive layer, the printed image will be substantially distortedand/or destroyed. For example, during delamination, a portion of the inkmay adhere to the cover and a portion of the ink may adhere to the imagereceptive layer.

FIG. 6 is a diagrammatic representation of a method of fabricatingintermediate structure 404 of image retaining card 400 of FIG. 5. FIG. 6illustrates a co-extrusion system 700 including a first extruder 702, asecond extruder 704, and a third extruder 706. First extruder 702 has afirst material hopper 722 holding a first tie layer material 786.Likewise, second extruder 704 has a second material hopper 724 holding asecond tie layer material 788. Third extruder 706 has a third materialhopper 726 holding a backing layer material 790.

In the embodiment of FIG. 6, first extruder 702, second extruder 704,and third extruder 706 are all coupled to a co-extrusion head 708. Amulti-layered extrudate 720 is shown exiting co-extrusion head 708.Multi-layered extrudate 720 comprises first tie layer 486, second tielayer 488, and backing layer 490. In a preferred embodiment, first tielayer 486 and second tie layer 488 are comprised of the same material.In this preferred embodiment a single extruder may be utilized to supplyco-extrusion head 708 with tie layer material.

Multi-layered extrudate 720 exits co-extrusion head 708 and enters alaminating station 762. In the embodiment of FIG. 6, laminating station762 includes a plurality of laminating rollers 766. A first unwindstation 746 feeds an image receptive material 784 into laminatingstation 762. In a preferred embodiment, laminating rollers 766 areadapted to apply heat and pressure to image receptive material 784. In apreferred method in accordance with the present invention, laminatingstation 762 is adapted to heat bond image receptive material 784 tofirst tie layer 486 forming a laminate 768.

In the embodiment of FIG. 6, laminate 768 exits laminating station 762and enters a die cutting station 770. In the embodiment of FIG. 6, diecutting station 770 includes a cutting die 772 fixed to a cutting diecylinder 777, and an anvil cylinder 776. Cutting die 772 is adapted tocut intermediate structure blanks 796 from laminate 768. In FIG. 6, aplurality of intermediate structure blanks 796 are show disposed in abin 780. A web weed 782 formed by the remainder of laminate 768 exitsdie cutting station 770 and is wound onto a roll 740 of a rewind station736.

FIG. 7 is a diagrammatic representation of an additional method whichmay be utilized to fabricate intermediate structure 404 of imageretaining card 400 of FIG. 5. In FIG. 7, a first unwind station 442 isillustrated. First unwind station 442 includes a first roll 446comprising a plurality of turns of a backing layer web 492. In apreferred embodiment, backing layer web 492 comprises the same materialas backing layer 490 of FIG. 5.

As shown in FIG. 7, backing layer web 492 is unwound from first roll 446and passes through a first corona treating station 448. In theembodiment of FIG. 7, first corona treating station 448 includes atreatment roller 450, an electrode assembly 452, and a plurality ofguide rollers 454. Subjecting a backing layer web 492 to coronatreatment prior to coating desirably increases the adhesion of thecoated layer to substrate web 444. Equipment suitable for coronatreating a material is commercially available from Enercon IndustriesCorporation of Menomonee Falls, Wis., Pillar Technologies of Hartland,Wis., and Corotec Corporation of Farmington, Conn. Other surfacetreatment methods may be utilized without deviating from the spirit andscope of the present invention. Examples of surface treatment methodsinclude plasma treating, chemical treating, and flame treating.Equipment suitable for flame treating a material is commerciallyavailable from Flynn Burner Corporation of New Rochelle, N.Y. Plasmatreating typically involves exposing the material to a charged gaseousatmosphere.

After passing through first corona treatment station 448, backing layerweb 492 enters a first coating station 456. In the embodiment of FIG. 7,first coating station 456 comprises a coating die 458, an extruder 412,and a backing roller 460. First coating station 456 applies a first tielayer 486 to backing layer web 492.

Backing layer web 492 exits first coating station 456 and enters asecond corona treating station 494. Second corona treating station 494includes a treatment roller 450, an electrode assembly 452, and aplurality of guide rollers 454. Second corona treating station 494 isadapted to treat a bottom surface of backing layer web 492.

Upon exiting second corona treating station 494, backing layer web 492enters a second coating station 495 comprising a coating die 458, anextruder 412, and a backing roller 460. Second coating station 495applies a second tie layer 488 to backing layer web 492.

After passing through second coating station 495, backing layer web 492enters a laminating station 462. In the embodiment of FIG. 7, laminatingstation 462 includes a plurality of laminating rollers 466. A secondunwind station 464 feeds an image receptive layer 484 into laminatingstation 462. In a preferred embodiment, laminating rollers 466 areadapted to apply heat and pressure to backing layer web 492 and imagereceptive layer 484. In a preferred method in accordance with thepresent invention, laminating station 462 is adapted to heat bond imagereceptive layer 484 to first tie layer and backing layer web 492 forminga laminate 468.

Laminate 468 enters a die cutting station 470. In the embodiment of FIG.7, die cutting station 470 includes a cutting die 472 fixed to a cuttingdie cylinder 474, and an anvil cylinder 476. Cutting die 472 is adaptedto cut intermediate structure blanks 496 from laminate 468. In FIG. 7, aplurality of intermediate structure blanks 496 are show disposed in abin 480. A web weed 482 formed by the remainder of laminate 468 exitsdie cutting station 470 and is wound onto a roll 440 of a rewind station436.

Having thus described FIG. 5, FIG. 6, and FIG. 7, methods in accordancewith the present invention may now be described with reference thereto.It should be understood that steps may be omitted from each processand/or the order of the steps may be changed without deviating from thespirit or scope of the invention. It is anticipated that in someapplications, two or more steps may be performed more or lesssimultaneously to promote efficiency.

A method of fabricating an image retaining card may begin with the stepof providing an intermediate structure blank, a substrate blank, and acard cover. An image may then be printed onto the image receptive layerof the intermediate structure blank. In a preferred method, the image isprinted onto the image receptive layer of the intermediate structureblank utilizing an inkjet printer.

A method in accordance with the present invention may include the stepof laminating a cover over the image receptive layer of the intermediatestructure. A method in accordance with the present invention may alsoinclude the step of laminating a substrate to a second side of theintermediate structure. The step of laminating may include the steps ofassembling a stack of card components, inserting the stack into aprotective sheath, and inserting the sheath into a laminator.

FIG. 8 is a partially exploded cross-sectional view of an additionalembodiment of an image retaining card 500 in accordance with the presentinvention. Image retaining card 500 comprises a substrate structure 502,and an image receptive cover 506. In a preferred embodiment imagereceptive cover 506 is fixed to substrate structure 502. In aparticularly preferred embodiment, image receptive cover 506 is heatbonded to substrate structure 502.

Image receptive cover 506 includes a plurality of recesses 598. An imagereceptive material 522 is disposed within recesses 598 of imagereceptive cover 506. A printed image 526 comprising an ink 528 isdisposed proximate an image receptive material 522. In a preferredembodiment, ink 528 comprises an aqueous ink 528. In a particularlypreferred embodiment ink 528 comprises an aqueous ink 528 adapted foruse in an inkjet printer.

In a preferred embodiment, image receptive material 522 is adapted toreceive an image comprised of aqueous ink. It should be appreciated thatimage receptive material 522 may comprise many materials withoutdeviating from the spirit and scope of the present invention. Examplesof materials which may be suitable in some applications include alumina,silica, hydrophilic organic particles, and cellulose polymers. Examplesof cellulose polymers include hydroxymethyl cellulose. Examples ofcommercially available cellulose polymers include METHOCEL, which iscommercially available from Dow Chemical Corporation.

Suitable hydrophilic organic particles comprise crosslinked homopolymersand copolymers of N-vinyllactams such as homopolymers and copolymers ofN-vinylpyrrolidone and homopolymers and copolymers ofN-vinylcaprolactam, homopolymers and copolymers of N-vinylimidazoles,homopolymers and copolymers of vinylpyridine, and substitutedderivatives thereof. Homopolymers and copolymers of N-vinyllactams andN-vinylimidazoles are preferred. Crosslinked particles ofpoly(N-vinylpyrrolidone) and poly(N-vinylimidazole) are most preferred.

Image retaining card 500 of FIG. 8 may comprise an identification card,a driver's license, a passport, etc. having a printed image 526. In apreferred embodiment, 30 printed image 526 includes one or more securityindicia. Examples of security indicia which may be suitable in someapplications include, a picture of a human face, a representation of ahuman finger print, and a representation of a cardholder's signature.

In a preferred embodiment, image receptive cover 506 comprises asubstantially optically transparent polymeric film. Also in a preferredembodiment, image receptive cover 506 comprises an ionomeric polymer.Particularly preferred ionomeric polymers are copolymers of ethylenewith methacrylic acid. E. I. DuPont de Nemours Company produces a lineof neutralized ethylene-co-methacrylic acid ionomeric polymers under thetrade designation “SURLYN” that are acceptable for the present use.Image receptive cover 506 may comprise other materials without deviatingfrom the spirit and scope of the present invention. Examples ofmaterials which may be suitable in some applications include polyvinylchloride (PVC), polypropylene (PP), polyethylene (PE), acrylic,polyester, biaxially oriented polypropylene, and copolyers thereof.Recesses 598 of image receptive cover 506 may be formed utilizing anembossing process.

Substrate structure 502 comprises a substrate layer 508 and a substratetie layer 520. In a preferred embodiment, substrate layer 508 iscomprised of polypropylene. An image retaining card includingpolypropylene exhibits good abrasion resistance, and crack resistance.

In a preferred embodiment, substrate tie layer 520 is comprised of afunctionalized polyolefin. An image retaining card including a substratetie layer comprising functionalized polyolefin exhibits good resistanceto delamination. Examples of functionalized olefins include anhydridemodified polypropylene, acid modified polyolefins, and acid/anhydridemodified polyolefins. Examples of commercially available materials whichmay be suitable in some applications include ELVAX 3175 ethylene vinylacetate polymer, and BYNEL 3101 acid/acrylate-modified ethylene vinylacetate polymer, ELVALOY 741 resin modifier, and FUSABOND polymericcoupling agent which are all commercially available from E. I. DuPont deNemours and Company of Wilmington, Del.

Having thus described FIG. 8, methods in accordance with the presentinvention may now be described with reference thereto. It should beunderstood that steps may be omitted from each process and/or the orderof the steps may be changed without deviating from the spirit or scopeof the invention. It is anticipated that in some applications, two ormore steps may be performed more or less simultaneously to promoteefficiency.

A method of fabricating an image retaining card may begin with the stepof providing a substrate blank, and an image retaining cover. An imagemay then be printed onto the image retaining cover. In a preferredmethod, the image is printed onto the image retaining cover utilizing aninkjet printer.

A method in accordance with the present invention may include the stepof laminating the image retaining cover to the substrate blank. The stepof laminating the image retaining cover to the substrate blank mayinclude the steps of laying the image retaining cover over the substrateblank, inserting the image retaining cover and the substrate blank intoa protective sheath, and inserting the sheath into a laminator.

EXAMPLES

The following examples further disclose embodiments of the invention. Inthe examples which follow, all percentages are by weight, unlessotherwise specified.

Example 1A

A substrate layer material comprising 96% polypropylene and 4% TiO₂ asprepared by combining 7C50 IMPACT polypropylene resin (Union CarbideCorporation, Danbury, Conn.) with a precompounded TiO₂/polypropylenematerial. The precompounded TiO₂/polypropylene material was purchasedfrom Clariant Corporation of New Hope, Minn. which identifies it by thepart number 1015100P. This material is precompounded at a ratio of 1part TiO₂ to 1 part polypropylene. The substrate layer material wasloaded into a twin screw extruder manufactured by Berstroff ofCharlotte, N.C. The twin screw extruder had a L/D equal to 32 and wasrun at 100 RPM with a temperature profile of 148° C.-176° C.-204°C.-218° C.-218° C.-218° C.-218° C.

The substrate tie layer material comprised ELVAX 3175 ethylene vinylacetate polymer available from E. I. DuPont de Nemours and Company ofWilmington, Del. The substrate tie layer material was loaded into asingle screw extruder manufactured by Davis-Standard, Pawcatuck, Conn.The single screw extruder had a L/D equal to 27 and was run atapproximately 10 RPM with a temperature profile of 148° C.-176° C.-218°C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.690 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.170 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.401 N/mm.

Example 1B

A substrate layer material comprising 76% polypropylene, 4% TiO₂, and20% ethylene vinyl acetate polymer was prepared by combining 7C50 IMPACTpolypropylene resin (Union Carbide Corporation, Danbury, Conn.) with aprecompounded TiO2/polypropylene material (Clariant #1015100P), andELVAX 3175 ethylene vinyl acetate polymer. The substrate layer materialwas loaded into a twin screw extruder manufactured by Berstroff ofCharlotte, N.C. The twin screw extruder had a L/D equal to 32 and wasrun at 100 RPM with a temperature profile of 148° C.-176° C.-204°C.-218° C.-218° C.-218° C.-218° C.

The substrate tie layer material comprised ELVAX 3175 ethylene vinylacetate polymer available from E. I. DuPont de Nemours and Company ofWilmington, Del. The substrate tie layer material was loaded into asingle screw extruder manufactured by Davis-Standard, Pawcatuck, Conn.The single screw extruder had a L/D equal to 27 and was run atapproximately 10 RPM with a temperature profile of 148° C.-176° C.-218°C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.730 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.070 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.600 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 2A

A substrate layer material comprising 96% polypropylene and 4% TiO2 asprepared by combining PRO-FAX 6433 Homopolymer polypropylene (Montell,Wilmington, Del.) with a precompounded TiO2/polypropylene material(Clariant #1015100P). The substrate layer material was loaded into atwin screw extruder manufactured by Berstroff of Charlotte, N.C. Thetwin screw extruder had a L/D equal to 32 and was run at 100 RPM with atemperature profile of 148° C.-176° C.-204° C.-218° C.-218° C.-218°C.-218° C.

The substrate tie layer material comprised ELVAX 3175 ethylene vinylacetate polymer available from E. I. DuPont de Nemours and Company ofWilmington, Del. The substrate tie layer material was loaded into asingle screw extruder manufactured by Davis-Standard, Pawcatuck, Conn.The single screw extruder had a L/D equal to 27 and was run atapproximately 10 RPM with a temperature profile of 148° C.-176° C.-218°C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.820 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.082 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.980 N/mm.

Example 2B

A substrate layer material comprising 76% polypropylene, 4% TiO2, and20% ethylene vinyl acetate polymer was prepared by combining PRO-FAX6433 Homopolymer polypropylene (Montell, Wilmington, Del.) with aprecompounded TiO2/polypropylene material (Clariant #1015100P), andELVAX 3175 ethylene vinyl acetate polymer. The substrate layer materialwas loaded into a twin screw extruder manufactured by Berstroff ofCharlotte, N.C. The twin screw extruder had a L/D equal to 32 and wasrun at 100 RPM with a temperature profile of 148° C.-176° C.-204°C.-218° C.-218° C.-218° C.-218° C.

The substrate tie layer material comprised ELVAX 3175 ethylene vinylacetate polymer available from E. I. DuPont de Nemours and Company ofWilmington, Del. The substrate tie layer material was loaded into asingle screw extruder manufactured by Davis-Standard, Pawcatuck, Conn.The single screw extruder had a L/D equal to 27 and was run atapproximately 10 RPM with a temperature profile of 148° C.-176° C.-218°C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.840 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.060 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 1.240 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 3A

A substrate layer material comprising 96% polypropylene and 4% TiO2 asprepared by combining PRO-FAX 6433 Homopolymer polypropylene (Montell,Wilmington, Del.) with a precompounded TiO2/polypropylene material(Clariant #1015100P). The substrate layer material was loaded into atwin screw extruder manufactured by Berstroff of Charlotte, N.C. Thetwin screw extruder had a L/D equal to 32 and was run at 100 RPM with atemperature profile of 148° C.-176° C.-204° C.-218° C.-218° C.-218°C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.520 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.055 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.980 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 3B

A substrate layer material comprising 76% polypropylene, 4% TiO2, and20% acid/acrylate-modified ethylene vinyl acetate polymer was preparedby combining PRO-FAX 6433 Homopolymer polypropylene (Montell,Wilmington, Del.) with a precompounded TiO2/polypropylene material(Clariant #1015100P), and BYNEL 3101 acid/acrylate-modified ethylenevinyl acetate polymer. The substrate layer material was loaded into atwin screw extruder manufactured by Berstroff of Charlotte, N.C. Thetwin screw extruder had a L/D equal to 32 and was run at 100 RPM with atemperature profile of 148° C.-176° C.-204° C.-218° C.-218° C.-218°C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.680 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.180 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 1.240 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 4A

A substrate layer material comprising 96% polypropylene and 4% TiO2 asprepared by combining 7C50 IMPACT polypropylene resin (Union CarbideCorporation, Danbury, Conn.) with a precompounded TiO2/polypropylenematerial (Clariant #1015100P). The substrate layer material was loadedinto a twin screw extruder manufactured by Berstroff of Charlotte, N.C.The twin screw extruder had a L/D equal to 32 and was run at 100 RPMwith a temperature profile of 148° C.-176° C.-204° C.-218° C.-218°C.-218° C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.590 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.420 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.672 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 4B

A substrate layer material comprising 76% polypropylene, 4% TiO2, and20% acid/acrylate-modified ethylene vinyl acetate polymer was preparedby combining 7C50 IMPACT polypropylene resin (Union Carbide Corporation,Danbury, Conn.) with a precompounded TiO2/polypropylene material(Clariant #1015100P), and BYNEL 3101 acid/acrylate-modified ethylenevinyl acetate polymer. The substrate layer material was loaded into atwin screw extruder manufactured by Berstroff of Charlotte, N.C. Thetwin screw extruder had a L/D equal to 32 and was run at 100 RPM with atemperature profile of 148° C.-176° C.-204° C.-218° C.-218° C.-218°C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.560 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.020 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.823 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 5A

A substrate layer material comprising 92% ADFLEX KS-011P olefin, 4%polypropylene, and 4% TiO2 as prepared by combining ADFLEX KS-011Pthermoplastic olefin resin (Montell, Wilmington, Del.) withprecompounded TiO2/polypropylene material (Clariant #1015100P). Thesubstrate layer material was loaded into a twin screw extrudermanufactured by Berstroff of Charlotte, N.C. The twin screw extruder hada L/D equal to 32 and was run at 100 RPM with a temperature profile of148° C.-176° C.-204° C.-218° C.-218° C.-218° C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.530 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.200 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.738 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 5B

A substrate layer material comprising 72% ADFLEX KS-011P olefin, 4%polypropylene, 4% TiO2, and 20% acid/acrylate-modified ethylene vinylacetate polymer was prepared by combining ADFLEX KS-011P thermoplasticolefin resin (Montell, Wilmington, Del.) with a precompoundedTiO2/polypropylene material (Clariant #1015100P), and BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer. The substratelayer material was loaded into a twin screw extruder manufactured byBerstroff of Charlotte, N.C. The twin screw extruder had a L/D equal to32 and was run at 100 RPM with a temperature profile of 148° C.-176°C.-204° C.-218° C.-218° C.-218° C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.570 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.180 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 1.030 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 6A

A substrate layer material comprising 96% polypropylene copolymer and 4%TiO2 as prepared by combining FINA Z-9470 Polypropylene copolymer (FinaOil and Chemical Company, Dallas, Tex.) with a precompoundedTiO2/polypropylene material (Clariant #1015100P). The substrate layermaterial was loaded into a twin screw extruder manufactured by Berstroffof Charlotte, N.C. The twin screw extruder had a L/D equal to 32 and wasrun at 100 RPM with a temperature profile of 148° C.-176° C.-204°C.-218° C.-218° C.-218° C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.450 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.240 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.099 N/mm.

Example 6B

A substrate layer material comprising 76% polypropylene copolymer, 4%TiO2, and 20% acid/acrylate-modified ethylene vinyl acetate polymer wasprepared by combining FINA Z-9470 Polypropylene copolymer (Fina Oil andChemical Company, Dallas, Tex.) with a precompounded TiO2/polypropylenematerial (Clariant #1015100P), and BYNEL 3101 acid/acrylate-modifiedethylene vinyl acetate polymer. The substrate layer material was loadedinto a twin screw extruder manufactured by Berstroff of Charlotte, N.C.The twin screw extruder had a L/D equal to 32 and was run at 100 RPMwith a temperature profile of 148° C.-176° C.-204° C.-218° C.-218°C.-218° C.-218° C.

The substrate tie layer material comprised BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer available from E.I. DuPont de Nemours and Company of Wilmington, Del. The substrate tielayer material was loaded into a single screw extruder manufactured byDavis-Standard, Pawcatuck, Conn. The single screw extruder had a L/Dequal to 27 and was run at approximately 10 RPM with a temperatureprofile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.600 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.220 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.900 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 7

A substrate layer material comprising 76% polypropylene, 4% TiO2, and20% acid/acrylate-modified ethylene vinyl acetate polymer was preparedby combining PRO-FAX 6433 Homopolymer polypropylene (Montell,Wilmington, Del.) with a precompounded TiO2/polypropylene material(Clariant #1015100P), and BYNEL 3101 acid/acrylate-modified ethylenevinyl acetate polymer. The substrate layer material was loaded into atwin screw extruder manufactured by Berstroff of Charlotte, N.C. Thetwin screw extruder had a L/D equal to 32 and was run at 100 RPM with atemperature profile of 148° C.-176° C.-204° C.-218° C.-218° C.-218°C.-218° C.

The substrate tie layer material comprised 80% BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer and 20% ELVALOY741 resin modifier (both available from E. I. DuPont de Nemours andCompany of Wilmington, Del.). The substrate tie layer material wasloaded into a single screw extruder manufactured by Davis-Standard,Pawcatuck, Conn. The single screw extruder had a L/D equal to 27 and wasrun at approximately 10 RPM with a temperature profile of 148° C.-176°C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.580 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.160 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 2.100 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction was laminated using a TLC model 5560 thermal laminator. Theinterface temperature was about 145° C. The image quality was unchangedafter lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 8

A substrate layer material comprising 76% polypropylene, 4% TiO2, and20% acid/acrylate-modified ethylene vinyl acetate polymer was preparedby combining 7C50 IMPACT polypropylene resin (Union Carbide Corporation,Danbury, Conn.) with a precompounded TiO2/polypropylene material(Clariant #1015100P), and BYNEL 3101 acid/acrylate-modified ethylenevinyl acetate polymer. The substrate layer material was loaded into atwin screw extruder manufactured by Berstroff of Charlotte, N.C. Thetwin screw extruder had a L/D equal to 32 and was run at 100 RPM with atemperature profile of 148° C.-176° C.-204° C.-218° C.-218° C.-218°C.-218° C.

The substrate tie layer material comprised 80% BYNEL 3101acid/acrylate-modified ethylene vinyl acetate polymer and 20% ELVALOY741 resin modifier (both available from E. I. DuPont de Nemours andCompany of Wilmington, Del.). The substrate tie layer material wasloaded into a single screw extruder manufactured by Davis-Standard,Pawcatuck, Conn. The single screw extruder had a L/D equal to 27 and wasrun at approximately 10 RPM with a temperature profile of 148° C.-176°C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.610 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.140 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 1.680 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The image microporous film was placed on a substrate/tie layer compositeprepared as described above. The imaged microporous film was coveredwith a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 availablefrom E. I. DuPont de Nemours and Company of Wilmington, Del.). Theconstruction w as laminated using a TLC model 5560 thermal laminator.The interface temperature was about 145° C. The image quality wasunchanged after lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 9

A substrate layer material comprising 96% polypropylene and 4% TiO2 asprepared by combining 7C50 IMPACT polypropylene resin (Union CarbideCorporation, Danbury, Conn.) with a precompounded TiO2/polypropylenematerial (Clariant #1015100P). The su bstrate layer material was loadedinto a twin screw extruder manufactured by Berstroff of Charlotte, N.C.The twin screw extruder had a L/D equal to 32 and was run at 100 RPMwith a temperature profile of 148° C.-176° C.-204° C.-218° C.-218°C.-218° C.-218° C.

The substrate tie layer material comprised ELVALOY AS resin modifieravailable from E. I. DuPont de Nemours and Company of Wilmington, Del.The substrate tie layer material was loaded into a single screw extrudermanufactured by Davis-Standard, Pawcatuck, Conn. The single screwextruder had a L/D equal to 27 and was run at approximately 10 RPM witha temperature profile of 148° C.-176° C.-218° C.

A substrate structure comprising a substrate layer and a substrate tielayer was prepared by co-extrusion. Both extruders were equipped withdownstream metering pumps. The melt streams downstream of the meteringpumps from both extruders were fed into a co-extrusion die. Thesubstrate layer material was extruded to produce a final thickness of0.540 mm and the substrate tie layer material was extruded to produce afinal thickness of 0.315 mm. The extrudate from the die was cast on aheated chrome cast wheel and collected on a wind up wheel.

Two test samples were cut from the resulting substrate layer/substratetie layer composite. The test samples were placed one on top of theother with the tie layer of the first sample facing the tie layer of thesecond sample. The two samples were then heat bonded together. The heatbonding was performed using a TLC model 5660 (TLC, Evanston, Ill.)thermal laminator with the interface temperature of 148° C. A test stripmeasuring about 1″ wide and 5″ long was cut from the heat bondedmaterial.

A 180 T-peel adhesion test was performed on the test strip using anInstron model 1122 testing machine (Instron Corporation, Park Ridge,Ill.) equipped with a 500 N load cell. The crosshead speed was set to 6inches/minute. The test strip failed at one of the substrate layer tosubstrate tie layer interfaces. The force to separate the test strip wasrecorded as 0.341 N/mm.

A sheet of microporous film (TESLIN available from PPG Industries ofPittsburgh Pa.) was imaged using an EPSON STYLUS COLOR 850 inkjetprinter (available from U S Epson, Inc. of Torrance, Calif.) equippedwith pigment/dye blend inkjet inks (cartridges ARC-S020108 (black) andARC-S020089 (color) from MIS Associates Inc. of Lake Orion Mich.). Theresulting image exhibited high color density and excellent linesharpness with no bleed or feathering between colors.

The imaged microporous film was placed on a substrate/tie layercomposite prepared as described above. The imaged microporous film wascovered with a sheet of ethylene-methacrylic acid ionomer (SURLYN 1707available from E. I. DuPont de Nemours and Company of Wilmington, Del.).The construction was laminated using a TLC model 5560 thermal laminator.The interface temperature was about 145° C. The image quality wasunchanged after lamination.

An attempt was made to separate the microporous film from thesubstrate/tie layer composite. The microporous film tore and/orstretched in a way which destroyed the integrity of the image. Thisindicated good interfacial adhesion between the microporous film and thesubstrate tie layer.

An attempt was made to separate the ethylene-methacrylic acid ionomerfilm from the microporous film. The ethylene-methacrylic acid ionomerfilm tore with some transfer of the image from the microporous film tothe ethylene-methacrylic acid ionomer film. This destroyed the imageintegrity and indicated good adhesion between the microporous film andthe ethylene-methacrylic acid ionomer film.

Example 10

A sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 available fromE. I. DuPont de Nemours and Company of Wilmington, Del.) wasmicroembossed with a pattern. The pattern comprised an array of 40micrometer deep square wells that were surrounded by walls which were31.2 micrometers thick at their base and 20 micrometers thick at theirtop surface. The center to center spacing of the walls was 125.0micrometers.

The ionomer sheet was pressed against an embossing tool containing theinverse of the desired pattern in a compression molding press. Theembossing tool was comprised of SILASTIC J. (SILASTIC J is a siliconeelastomer available from Dow Coming Co. of Midland, Mich.) The pressutilized was a Wabash model 20-122TM2WCB press from Wabash MPI ofWabash, Ind. The temperature of the platens was 150° C. A pressure ofabout 2.9 MPa was applied for about five minutes. The load was appliedfor an additional 5-10 minutes while the platens were cooled to about49° C. The platens were then opened and the embossed film was removedfrom the embossing tool.

An ink receptor solution was prepared by combining the materials listedin the table below:

wt % MATERIAL 12 crosslinked poly(vinylpyrrolidone) particles(POLYPLASDONE INF-10 available from International Specialty Products ofWayne New Jersey) 8 ethylene-vinyl acetate polymer latex binder emulsion(AIRFLEX 426 available from Air Products and Chemicals of Allentown,Pennsylvania) 40 Water 40 IPA

This ink receptor composition was coated onto the microembossed surfaceof the ionomer film using a #10 Meyer rod (nominal wet thickness=0.023mm) and dried in a convection oven at about 70° C. Thecoated-microembossed surface was then imaged using a HP2000C inkjetprinter equipped with aqueous inks using the premium inkjet paper/bestquality settings.

The imaged film was placed on the substrate tie layer composite preparedas described in example 7 above with the imaged side of the imaged filmfacing the tie layer of the substrate tie layer composite. Theconstruction was laminated using a TLC Model 5660 thermal laminator withan interface temperature of about 145° C. The image quality wasunchanged after laminating.

An attempt was made to separate the imaged-microembossed film from thesubstrate/tie layer composite. The imaged-microembossed film tore and/orstretched with some image transfer to the substrate/tie layer compositedestroying the image integrity and indicating that there was goodinterfacial adhesion between the imaged-microembossed film and thesubstrate/tie layer composite.

Example 11

A sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 available fromE. I. DuPont de Nemours and Company of Wilmington, Del.) wasmicroembossed with a pattern. The pattern comprised an array of 40micrometer deep square wells that were surrounded by walls which were31.2 micrometers thick at their base and 20 micrometers thick at theirtop surface. The center to center spacing of the walls was 125.0micrometers.

The ionomer sheet was pressed against an embossing tool containing theinverse of the desired pattern in a compression molding press. Theembossing tool was comprised of SILASTIC J. (SILASTIC J is a siliconeelastomer available from Dow Corning Co. of Midland, Mich.). The pressutilized was a Wabash model 20-122TM2WCB press from Wabash MPI ofWabash, Ind. The temperature of the platens was 150° C. A pressure ofabout 2.9 MPa was applied for about five minutes. The load was appliedfor an additional 5-50 minutes while the platens were cooled to about49° C. The platens were then opened and the embossed film was removedfrom the embossing tool.

An ink receptor solution was prepared by combining the materials listedin the table below:

wt % MATERIAL 12 crosslinked poly(vinylpyrrolidone) particles(POLYPLASDONE INF-10 available from International Speciaity Products ofWayne New Jersey) 8 ethylene-vinyl acetate polymer latex binder emulsion(AIRFLEX 426 available from Air Products and Chemicals of Allentown,Pennsylvania) 40 Water 40 IPA

This ink receptor composition was coated onto the microembossed surfaceof the ionomer film using a #10 Meyer rod (nominal wet thickness=0.023mm) and dried in a convection oven at about 70° C. Thecoated-microembossed surface was then imaged using a HP2000C inkjetprinter equipped with aqueous inks using the premium inkjet paper/bestquality settings.

The imaged film was placed on the substrate tie layer composite preparedas described in example 8 above with the imaged side of the imaged filmfacing the tie layer of the substrate tie layer composite. Theconstruction was laminated using a TLC Model 5560 thermal laminator withan interface temperature of about 145° C. The image quality wasunchanged after laminating.

An attempt was made to separate the imaged-microembossed film from thesubstrate/tie layer composite. The imaged-microembossed film tore and/orstretched with some image transfer to the substrate/tie layer compositedestroying the image integrity and indicating that there was goodinterfacial adhesion between the imaged-microembossed film and thesubstrate/tie layer composite.

Example 12

A sheet of ethylene-methacrylic acid ionomer (SURLYN 1707 available fromE. I. DuPont de Nemours and Company of Wilmington, Del.) wasmicroembossed with a pattern. The pattern comprised an array of 40micrometer deep square wells that were surrounded by walls which were31.2 micrometers thick at their base and 20 micrometers thick at theirtop surface. The center to center spacing of the walls was 125.0micrometers.

The ionomer sheet was pressed against an embossing tool containing theinverse of the desired pattern in a compression molding press. Theembossing tool was comprised of SILASTIC J. (SILASTIC J is a siliconeelastomer available from Dow Coming Co. of Midland, Mich.) The pressutilized was a Wabash model 20-122TM2WCB press from Wabash MPI ofWabash, Ind. The temperature of the platens was 150° C. A pressure ofabout 2.9 MPa was applied for about five minutes. The load was appliedfor an additional 5-10 minutes while the platens were cooled to about49° C. The platens were then opened and the embossed film was removedfrom the embossing tool.

An ink receptor solution was prepared by combining the materials listedin the table below:

wt % MATERIAL 12 crosslinked poly(vinylpyrrolidone) particles(POLYPLASDONE INF-10 available from International Specialty Products ofWayne New Jersey) 8 ethylene-vinyl acetate polymer latex binder emulsion(AIRFLEX 426 available from Air Products and Chemicals of Allentown,Pennsylvania) 40 Water 40 IPA

This ink receptor composition was coated onto the microembossed surfaceof the ionomer film using a #10 Meyer rod (nominal wet thickness=0.023mm) and dried in a convection oven at about 70° C. Thecoated-microembossed surface was then imaged using a HP2000C inkjetprinter equipped with aqueous inks using the premium inkjet paper/bestquality settings.

The imaged film was placed on the substrate tie layer composite preparedas described in example 9 above with the imaged side of the imaged filmfacing the tie layer of the substrate tie layer composite. Theconstruction was laminated using a TLC Model 5560 thermal laminator withan interface temperature of about 145° C. The image quality wasunchanged after laminating.

An attempt was made to separate the imaged-microembossed film from thesubstrate/tie layer composite. The imaged-microembossed film tore and/orstretched with some image transfer to the substrate/tie layer compositedestroying the image integrity and indicating that there was goodinterfacial adhesion between the imaged-microembossed film and thesubstrate/tie layer composite.

Having thus described the preferred embodiments of the presentinvention, those of skill in the art will readily appreciate that yetother embodiments may be made and used within the scope of the claimshereto attached. Numerous advantages of the invention covered by thisdocument have been set forth in the foregoing description. It will beunderstood, however, that this disclosure is, in many respects, onlyillustrative. Changes may be made in details, particularly in matters ofshape, size, and arrangement of parts without exceeding the scope of theinvention. The invention's scope is, of course, defined in the languagein which the appended claims are expressed.

What is claimed is:
 1. An image retaining card, comprising: a substratestructure comprising polyolefin or copolymers thereof; a cover; and animage receptive material disposed between the cover and the substratestructure, wherein the image receptive material is porous.
 2. The imageretaining card of claim 1, wherein the substrate comprises polypropyleneor copolymers thereof.
 3. The image retaining card of claim 1, whereinone or more surfaces of the substrate are functionalized.
 4. The imageretaining card of claim 1, wherein the substrate structure furtherincludes a substrate tie layer and a substrate base layer.
 5. The imageretaining card of claim 1, wherein the substrate structure furtherincludes a substrate tie layer comprising a tie material and a substratebase layer comprising the tie material blended with polyolefin orcopolymers thereof.
 6. The image retaining card of claim 1, wherein thecover is optically transparent.
 7. The image retaining card of claim 1,further including a printed image disposed proximate the image receptivematerial.
 8. The image retaining card of claim 1, further including aprinted image comprising aqueous ink disposed proximate the imagereceptive material.
 9. The image retaining card of claim 1, furtherincluding a printed image disposed proximate the image receptivematerial; the printed image comprising aqueous ink adapted for use in aninkjet printer.
 10. The image retaining card of claim 1, wherein theimage receptive material comprises a microporous polymeric film.
 11. Theimage retaining card of claim 1, wherein the image receptive materialcomprises polyethylene and silica.
 12. The image retaining card of claim1, wherein the cover comprises an ethylene-methacrylic acid ionomer. 13.An image retaining card, comprising: a substrate structure including asubstrate base layer and a substrate tie layer overlaying the substratebase layer; the substrate base layer comprising polypropylene; thesubstrate tie layer comprising functionalized polyolefin; a cover; andan image receptive material disposed between the cover and the substratestructure, wherein the image receptive material is porous.
 14. The imageretaining card of claim 13, wherein the cover is optically transparent.15. The image retaining card of claim 13, further including a printedimage disposed proximate the image receptive material.
 16. The imageretaining card of claim 13, further including a printed image comprisingaqueous ink disposed proximate the image receptive material.
 17. Theimage retaining card of claim 13, further including a printed imagedisposed proximate the image receptive material; the printed imagecomprising aqueous ink adapted for use in an inkjet printer.
 18. Theimage retaining card of claim 13, wherein the image receptive materialcomprises a microporous polymeric film.
 19. The image retaining card ofclaim 13, wherein the substrate base layer comprises a tie materialblended with polyolefin or copolymers thereof.